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H.B. Fuller FH8708T Epoxy Edge Bond Adhesive, Low CTE
H.B. Fuller FH8708T is a low-CTE epoxy edge bond adhesive for reliable structural reinforcement of CSP/BGA components.
- Good dispensing and shape retention
- Low CTE
- Good reliability
H.B. Fuller FH8708T is a low-CTE epoxy edge bond adhesive for reliable structural reinforcement of CSP/BGA components. It dispenses well with good shape retention and is used in automotive electronics PCB assembly. FEYANA supplies H.B. Fuller FH8708T together with technical documentation and application selection support.
Key features
- Good dispensing and shape retention
- Low CTE
- Good reliability
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 41,280 |
| Cure schedule | 5 min @ 120°C |
| Glass transition Tg (°C) | 163 |
| CTE α1 (ppm) | 24 |
| Pot life at 25°C (hours) | 8 |
| Shelf life (months) | 6 @ 2-8°C |
| Chemistry | Epoxy |
| Glass transition Tg (°C) – PCB assembly | 95 |
| Shelf life (months) – PCB assembly | 6 @ -20°C |
Applications
- Edge bonding for structural reinforcement of CSP/BGA components
- Automotive electronics PCB assembly
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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