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H.B. Fuller FH8707HF Edge Bond Adhesive for BGA Side Fill
H.B. Fuller FH8707HF is a very high-viscosity, heat-cure edge bond adhesive for BGA side fill and CSP/BGA reinforcement.
- Works on narrow-edge CSP and WLCSP
- Cure schedule: 120s @ 120°C or 90s @ 150°C
- Tg 105°C
H.B. Fuller FH8707HF is a very high-viscosity, heat-cure edge bond adhesive for BGA side fill and CSP/BGA reinforcement. It works on narrow-edge CSP or WLCSP and cures quickly (90s @ 150°C). FEYANA supplies H.B. Fuller FH8707HF together with technical documentation and application selection support.
Key features
- Works on narrow-edge CSP and WLCSP
- Cure schedule: 120s @ 120°C or 90s @ 150°C
- Tg 105°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 340,000 |
| Cure schedule | 120s @ 120°C or 90s @ 150°C |
| Glass transition Tg (°C) | 105 |
| CTE α1 (ppm) | 67 |
| Pot life at 25°C (hours) | 8 |
| Shelf life (months) | 6 @ 2-8°C |
Applications
- Edge bonding for structural reinforcement of CSP/BGA components
- BGA side fill
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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