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H.B. Fuller EH9623LV Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it is designed for LCM light blocking, with ultra-low viscosity for thickness control and very fast set.
- Designed for LCM light blocking
- Ultra-low viscosity for thickness control
- Very fast set
H.B. Fuller EH9623LV is a black reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It is designed for LCM light blocking, with ultra-low viscosity for thickness control and very fast set. It has a viscosity of 865 cPs @ 100°C at application temperature, an open time of 40 sec, cures in 24 hours and reaches 5.1 MPa overlap shear strength on PC-PC. FEYANA supplies EH9623LV to electronics assembly plants.
Key features
- Designed for LCM light blocking
- Ultra-low viscosity for thickness control
- Very fast set
- Viscosity at application temperature: 865 cPs @ 100°C
- Open time: 40 sec
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 5.1 MPa
Technical data
| Color | Black |
|---|---|
| Viscosity at application temperature | 865 cPs @ 100°C |
| Open time (min) | 40 sec |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 5.1 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
- LCM light blocking
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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