FEYANA one-component thermally conductive epoxy bonds components to heat sinks with strong structural adhesion while conducting heat. Heat cured with high hardness, it suits automated dispensing lines.
Specifications
| Brand | FEYANA |
|---|---|
| Chemistry | One-component heat-cure epoxy |
| Thermal conductivity | 1.54 – 5.5 W/mK |
Product range
| Product | Color | Viscosity (cps) / thixotropic index | Pot life 25°C (days) | Curing | Tg (°C) | Hardness Shore | Thermal conductivity (W/mK) | Operating temp. (°C) |
|---|---|---|---|---|---|---|---|---|
| JC953-1 | White | 178,000~267,000/3.2~3.6 | 3 | 150°C×30 min | 68 | D89 | 1.54 | -40~150 |
| JE538 | White | 50,000~90,000 | 3 | 80°C×30 min | 26 | D89 | 2.4 | -40~120 |
| JB688-28 | Gray | 150,000~230,000/>2.2 | 3 | 150°C×60 min | 99 | D90 | 3 | -40~180 |
| JE538-1 | Gray | 50,000~90,000 | 3 | 80°C×30 min | 26 | D89 | 2.4 | -40~120 |
| JB688-29 | Gray-black | 350,000~570,000/>2.2 | 3~5 | 130°C×60 min | 113 | D91 | 3.5 | -40~150 |
| GB012 | Black | 150,000~200,000 | 1 | 80°C×120 min | 82 | D96 | 5.5 | -40~120 |
Typical values from FEYANA technical data for selection reference only; please test on your actual substrates before mass production. Viscosity, colour, cure speed and packaging can be customised on request.
Key features
- Structural bonding plus heat transfer
- High hardness D89–D96, Tg up to 113°C
- No mixing, dispensing-ready
Applications
- Bonding heat sinks to power components
- Fixing thermal sensors and electronic parts
- LED modules and power supplies
Technical support and quotation
Send FEYANA your substrates, operating conditions (temperature, environment), thermal conductivity, flame-retardancy and hardness requirements, application method (manual, cartridge gun, dispensing machine) and volume for product recommendation, samples and a quotation. We supply from Vietnam across Southeast Asia.
- WhatsApp / Phone: +84 988 641 591
- Email: sales.00@feyana.com






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