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H.B. Fuller FH8731 Chip-on-Board Glob Top, High Flow
H.B. Fuller FH8731 is a one-part, heat-cure glob top encapsulant designed for wire-bonded chip-on-board die.
- Purpose-designed for wire-bond chip glob top
- High-flow material
- Cure schedule: 20 min @ 150°C
H.B. Fuller FH8731 is a one-part, heat-cure glob top encapsulant designed for wire-bonded chip-on-board die. It is a high-flow material with a Tg of 129°C and cures in 20 min @ 150°C. FEYANA supplies H.B. Fuller FH8731 together with technical documentation and application selection support.
Key features
- Purpose-designed for wire-bond chip glob top
- High-flow material
- Cure schedule: 20 min @ 150°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 36,400 |
| Cure schedule | 20 min @ 150°C |
| Glass transition Tg (°C) | 129 |
| CTE α1 (ppm) | 58 |
| Pot life at 25°C (hours) | 72 |
| Shelf life (months) | 12 @ 2-8°C |
Applications
- Chip-on-board glob top encapsulation of wire-bonded die
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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