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H.B. Fuller FH8732 Chip-on-Board Glob Top, Low CTE
H.B. Fuller FH8732 is a heat-cure glob top encapsulant for wire-bonded chip-on-board die, combining high flow with a very low CTE (CTE α1 17 ppm).
- Purpose-designed for wire-bond chip glob top
- High-flow material
- Low CTE
H.B. Fuller FH8732 is a heat-cure glob top encapsulant for wire-bonded chip-on-board die, combining high flow with a very low CTE (CTE α1 17 ppm). It cures in two steps: 30 min @ 125°C + 90 min @ 165°C. FEYANA supplies H.B. Fuller FH8732 together with technical documentation and application selection support.
Key features
- Purpose-designed for wire-bond chip glob top
- High-flow material
- Low CTE
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 35,000 |
| Cure schedule | 30 min @ 125°C + 90 min @ 165°C |
| Glass transition Tg (°C) | 95 |
| CTE α1 (ppm) | 17 |
| Pot life at 25°C (hours) | 8 |
| Shelf life (months) | 6 @ -40°C |
Applications
- Chip-on-board glob top encapsulation of wire-bonded die
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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