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H.B. Fuller FH8303 WLCSP Underfill, Low CTE
H.B. Fuller FH8303 is a heat-cure underfill for WLCSP and flip chip packages, designed for high-reliability WLCSP applications.
- Low CTE
- Cure schedule: 30 min @ 150°C
- Tg 136°C
H.B. Fuller FH8303 is a heat-cure underfill for WLCSP and flip chip packages, designed for high-reliability WLCSP applications. It has a low CTE (CTE α1 32 ppm) and a Tg of 136°C. FEYANA supplies H.B. Fuller FH8303 together with technical documentation and application selection support.
Key features
- Low CTE
- Cure schedule: 30 min @ 150°C
- Tg 136°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 2,500 |
| Cure schedule | 30 min @ 150°C |
| Glass transition Tg (°C) | 136 |
| CTE α1 (ppm) | 32 |
| Pot life at 25°C (hours) | 24 |
| Shelf life (months) | 6 @ -40°C |
Applications
- Underfill for flip chip and wafer-level chip scale packages (WLCSP)
- High-reliability WLCSP applications
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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