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H.B. Fuller FH8307 Epoxy Underfill for Automotive Electronics
H.B. Fuller FH8307 is an epoxy underfill for automotive electronics PCB assembly, suited to various IC packages including BGA/CSP and SIP.
- High Tg and low CTE
- Withstands lead-free reflow after JEDEC Level II exposure
- Cure schedule: 10 min @ 160°C
H.B. Fuller FH8307 is an epoxy underfill for automotive electronics PCB assembly, suited to various IC packages including BGA/CSP and SIP. It has a high Tg (130°C), low CTE and withstands lead-free reflow after JEDEC Level II exposure. FEYANA supplies H.B. Fuller FH8307 together with technical documentation and application selection support.
Key features
- High Tg and low CTE
- Withstands lead-free reflow after JEDEC Level II exposure
- Cure schedule: 10 min @ 160°C
Technical data
| Chemistry | Epoxy |
|---|---|
| Color | Black |
| Viscosity at 25°C (cPs) | 4,720 |
| Cure schedule | 10 min @ 160°C |
| Glass transition Tg (°C) | 130 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Automotive electronics PCB assembly
- Various IC packages including BGA/CSP and SIP
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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