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H.B. Fuller FH8014A Room-Temp Flow Epoxy Underfill, Automotive
H.B. Fuller FH8014A is a high-performance epoxy underfill for automotive electronics PCB assembly.
- Easy capillary flow at room temperature
- High-performance underfill
- Very good reworkability
H.B. Fuller FH8014A is a high-performance epoxy underfill for automotive electronics PCB assembly. It flows easily by capillary action at room temperature and offers very good reworkability. FEYANA supplies H.B. Fuller FH8014A together with technical documentation and application selection support.
Key features
- Easy capillary flow at room temperature
- High-performance underfill
- Very good reworkability
Technical data
| Chemistry | Epoxy |
|---|---|
| Color | Black |
| Viscosity at 25°C (cPs) | 656 |
| Cure schedule | 10 min @ 130°C |
| Glass transition Tg (°C) | 82 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Automotive electronics PCB assembly
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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