Tiếng Việt
中文 (中国)New
H.B. Fuller FH8017M Fast-Flow CSP Underfill for FPC
H.B. Fuller FH8017M is a fast-flow board-level CSP underfill designed for flexible printed circuit (FPC) applications.
- Fast-flow CSP underfill
- Very good reworkability
- Cure schedule: 5 min @ 120°C
H.B. Fuller FH8017M is a fast-flow board-level CSP underfill designed for flexible printed circuit (FPC) applications. It cures in 5 min @ 120°C and offers very good reworkability. FEYANA supplies H.B. Fuller FH8017M together with technical documentation and application selection support.
Key features
- Fast-flow CSP underfill
- Very good reworkability
- Cure schedule: 5 min @ 120°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 600 |
| Cure schedule | 5 min @ 120°C |
| Glass transition Tg (°C) | 42 |
| CTE α1 (ppm) | 65 |
| Pot life at 25°C (hours) | 72 |
| Shelf life (months) | 6 @ 2-8°C |
Applications
- Board-level underfill for CSP/BGA reinforcement
- Flexible printed circuit (FPC) applications
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
Only logged in customers who have purchased this product may leave a review.
Reviews
There are no reviews yet.