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H.B. Fuller FH8020 Low-Modulus Underfill for SMD Protection
H.B. Fuller FH8020 is a soft, low-modulus heat-cure underfill for CSP/BGA reinforcement and SMD protection on high-density PCBAs.
- Soft, low-modulus material
- Fast cure with low shrinkage
- Cure schedule: 8 min @ 150°C
H.B. Fuller FH8020 is a soft, low-modulus heat-cure underfill for CSP/BGA reinforcement and SMD protection on high-density PCBAs. It cures fast with low shrinkage. FEYANA supplies H.B. Fuller FH8020 together with technical documentation and application selection support.
Key features
- Soft, low-modulus material
- Fast cure with low shrinkage
- Cure schedule: 8 min @ 150°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 13,000 |
| Cure schedule | 8 min @ 150°C |
| Glass transition Tg (°C) | 61 |
| CTE α1 (ppm) | 78 |
| Pot life at 25°C (hours) | 72 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Board-level underfill for CSP/BGA reinforcement
- SMD protection on high-density PCBAs
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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