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H.B. Fuller FH8621 Low-Temperature Cure Adhesive for PA & LCP
One-part low-temperature cure adhesive (10 min @ 80°C) for heat-sensitive parts; tough, good bond strength on PA and LCP.
- One-part, premixed, low-temperature cure
- Excellent toughness
- Good jetting performance
H.B. Fuller FH8621 is a one-part, premixed, low-temperature cure adhesive for heat-sensitive parts such as camera modules, sensors, touch panels and wearables. It offers excellent toughness, good jetting performance and good bond strength on PA and LCP. It is black, has a viscosity of 9,200 cPs at 25°C and cures at 10 min @ 80°C. FEYANA supplies FH8621 to electronics assembly plants.
Key features
- One-part, premixed, low-temperature cure
- Excellent toughness
- Good jetting performance
- Good bond strength to PA and LCP
- Cure schedule: 10 min @ 80°C
- Pot life 3 days at 25°C; shelf life 6 months at -20°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 9,200 |
| Cure schedule | 10 min @ 80°C |
| Pot life at 25°C (days) | 3 |
| Shelf life at -20°C (months) | 6 |
Applications
- Camera modules, sensors, touch panels, wearables and other heat-sensitive parts
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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