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H.B. Fuller FH8620 Low-Temperature Cure Adhesive for Lens Bonding
One-part low-temperature cure adhesive (20 min @ 80°C; 50 min @ 70°C) for heat-sensitive parts; high bond strength, stencil printable, lens bonding.
- One-part, premixed, low-temperature cure
- High bond strength despite low-temperature cure
- Stencil printable
H.B. Fuller FH8620 is a one-part, premixed, low-temperature cure adhesive for heat-sensitive parts such as camera modules, sensors, touch panels and wearables. It combines low-temperature cure with high bond strength, is stencil printable and is used for lens bonding. It is black, has a viscosity of 35,000 cPs at 25°C and cures at 20 min @ 80°C; 50 min @ 70°C. FEYANA supplies FH8620 to electronics assembly plants.
Key features
- One-part, premixed, low-temperature cure
- High bond strength despite low-temperature cure
- Stencil printable
- Lens bonding adhesive
- Cure schedule: 20 min @ 80°C; 50 min @ 70°C
- Pot life 3 days at 25°C; shelf life 6 months at -20°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 35,000 |
| Cure schedule | 20 min @ 80°C; 50 min @ 70°C |
| Pot life at 25°C (days) | 3 |
| Shelf life at -20°C (months) | 6 |
Applications
- Lens bonding
- Camera modules, sensors, touch panels, wearables and other heat-sensitive parts
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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