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H.B. Fuller EH9656 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it delivers excellent reliability on plastic and metal substrates with fast curing.
- Excellent reliability on plastic and metal substrates
- Fast curing speed
- Viscosity at application temperature: 2,300 cPs @ 120°C
H.B. Fuller EH9656 is a light yellow reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It delivers excellent reliability on plastic and metal substrates with fast curing. It has a viscosity of 2,300 cPs @ 120°C at application temperature, an open time of 3 min, cures in 24 hours and reaches 8.4 MPa overlap shear strength on PC-PC. FEYANA supplies EH9656 to electronics assembly plants.
Key features
- Excellent reliability on plastic and metal substrates
- Fast curing speed
- Viscosity at application temperature: 2,300 cPs @ 120°C
- Open time: 3 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 8.4 MPa
Technical data
| Color | Light Yellow |
|---|---|
| Viscosity at application temperature | 2,300 cPs @ 120°C |
| Open time (min) | 3 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 8.4 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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