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H.B. Fuller EH9652 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it adheres excellently to PET and ABS and is capable of narrow-edge bonding.
- Excellent adhesion to PET and ABS
- Capable of narrow-edge bonding
- Viscosity at application temperature: 5,800 cPs @ 110°C
H.B. Fuller EH9652 is a light white reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It adheres excellently to PET and ABS and is capable of narrow-edge bonding. It has a viscosity of 5,800 cPs @ 110°C at application temperature, an open time of 6 min, cures in 24 hours and reaches 12.6 MPa overlap shear strength on PC-PC. FEYANA supplies EH9652 to electronics assembly plants.
Key features
- Excellent adhesion to PET and ABS
- Capable of narrow-edge bonding
- Viscosity at application temperature: 5,800 cPs @ 110°C
- Open time: 6 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 12.6 MPa
Technical data
| Color | Light White |
|---|---|
| Viscosity at application temperature | 5,800 cPs @ 110°C |
| Open time (min) | 6 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 12.6 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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