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H.B. Fuller FH8800 Optically Clear Die Attach Adhesive
H.B. Fuller FH8800 is an optically clear, one-part heat-cure die attach adhesive for camera modules and image sensors.
- Cure schedule: 10 min @ 120°C; 30 min @ 100°C
H.B. Fuller FH8800 is an optically clear, one-part heat-cure die attach adhesive for camera modules and image sensors. It also suits optically clear bonding and LED die attach. FEYANA supplies H.B. Fuller FH8800 together with technical documentation and application selection support.
Key features
- Cure schedule: 10 min @ 120°C; 30 min @ 100°C
Technical data
| Color | Optically Clear |
|---|---|
| Viscosity at 25°C (cPs) | 3,175 |
| Cure schedule | 10 min @ 120°C; 30 min @ 100°C |
| Pot life at 25°C (days) | 7 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Die attach in camera modules and image sensors
- Optically clear bonding or LED die attach
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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