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H.B. Fuller FH8808 Low-Warpage Die Attach Adhesive
H.B. Fuller FH8808 is a red one-part die attach adhesive for camera modules and image sensors.
- Low warpage and low stress
- Low outgassing
- Fast cure at low temperature
H.B. Fuller FH8808 is a red one-part die attach adhesive for camera modules and image sensors. It offers low warpage and stress, low outgassing, fast low-temperature cure (180 s @ 110°C) and high bond strength. FEYANA supplies H.B. Fuller FH8808 together with technical documentation and application selection support.
Key features
- Low warpage and low stress
- Low outgassing
- Fast cure at low temperature
- High bond strength
Technical data
| Color | Red |
|---|---|
| Viscosity at 25°C (cPs) | 18,730 |
| Cure schedule | 180 s @ 110°C |
| Pot life at 25°C (days) | 1 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Die attach in camera modules and image sensors
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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