Tiếng Việt
中文 (中国)
H.B. Fuller EH9689 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it is a general-purpose grade with excellent adhesion to metal and good green strength.
- General-purpose grade
- Excellent adhesion to metal
- Good green strength
H.B. Fuller EH9689 is a light yellow reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It is a general-purpose grade with excellent adhesion to metal and good green strength. It has a viscosity of 5,500 cPs @ 120°C at application temperature, an open time of 8 min, cures in 24 hours and reaches 6.6 MPa overlap shear strength on PC-PC. FEYANA supplies EH9689 to electronics assembly plants.
Key features
- General-purpose grade
- Excellent adhesion to metal
- Good green strength
- Viscosity at application temperature: 5,500 cPs @ 120°C
- Open time: 8 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 6.6 MPa
Technical data
| Color | Light Yellow |
|---|---|
| Viscosity at application temperature | 5,500 cPs @ 120°C |
| Open time (min) | 8 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 6.6 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
Only logged in customers who have purchased this product may leave a review.
Reviews
There are no reviews yet.