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H.B. Fuller EH9667 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it forms a tough polymer bond with excellent impact resistance and strong adhesion.
- Forms a tough polymer bond
- Excellent impact resistance and strong bonds
- Viscosity at application temperature: 5,500 cPs @ 110°C
H.B. Fuller EH9667 is a light yellow reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It forms a tough polymer bond with excellent impact resistance and strong adhesion. It has a viscosity of 5,500 cPs @ 110°C at application temperature, an open time of 4 min, cures in 24 hours and reaches 6.9 MPa overlap shear strength on PC-PC. FEYANA supplies EH9667 to electronics assembly plants.
Key features
- Forms a tough polymer bond
- Excellent impact resistance and strong bonds
- Viscosity at application temperature: 5,500 cPs @ 110°C
- Open time: 4 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 6.9 MPa
Technical data
| Color | Light Yellow |
|---|---|
| Viscosity at application temperature | 5,500 cPs @ 110°C |
| Open time (min) | 4 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 6.9 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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