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H.B. Fuller EH9686 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it delivers excellent reliability on plastic and metal substrates and good impact resistance with low modulus.
- Excellent reliability on plastic and metal substrates
- Good impact resistance with low modulus
- Viscosity at application temperature: 2,500 cPs @ 120°C
H.B. Fuller EH9686 is a light yellow reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It delivers excellent reliability on plastic and metal substrates and good impact resistance with low modulus. It has a viscosity of 2,500 cPs @ 120°C at application temperature, an open time of 6 min, cures in 24 hours and reaches 10.8 MPa overlap shear strength on PC-PC. FEYANA supplies EH9686 to electronics assembly plants.
Key features
- Excellent reliability on plastic and metal substrates
- Good impact resistance with low modulus
- Viscosity at application temperature: 2,500 cPs @ 120°C
- Open time: 6 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 10.8 MPa
Technical data
| Color | Light Yellow |
|---|---|
| Viscosity at application temperature | 2,500 cPs @ 120°C |
| Open time (min) | 6 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 10.8 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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