H.B. Fuller SN756 is a grey two-component silicone potting compound with 0.8 W/m.K thermal conductivity for circuit board protection and encapsulation. It is low stress, ages very well and cures at room temperature or faster with heat. FEYANA supplies H.B. Fuller SN756 together with technical documentation and application selection support.
Key features
- Thermally conductive, 0.8 W/m.K
- Low stress
- Excellent aging performance
Technical data
| Chemistry | Silicone |
|---|---|
| Color | Gray |
| Viscosity at 25°C (cPs) | A: 4,500 / B: 3,500 |
| Cure schedule | 24 hrs @ 23°C; 40 min @ 50°C |
| Hardness (Shore) | A 58 |
| Shelf life at 8-25°C (months) | 6 |
Applications
- Potting and encapsulation for circuit board protection
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com




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