Tiếng Việt
中文 (中国)New
H.B. Fuller SN558 Silicone Potting Compound for COG/COF
H.B. Fuller SN558 is a white, low-stress silicone compound for shallow potting and circuit board protection.
- Low stress
- Excellent thermal resistance
- Low ionic content
H.B. Fuller SN558 is a white, low-stress silicone compound for shallow potting and circuit board protection. With good thermal resistance, dielectric performance, low ionic content and no corrosion of ITO, it is also used for COG/COF protection in displays. FEYANA supplies H.B. Fuller SN558 together with technical documentation and application selection support.
Key features
- Low stress
- Excellent thermal resistance
- Low ionic content
- Non-corrosive to ITO
- Excellent dielectric properties
Technical data
| Chemistry | Silicone |
|---|---|
| Color | White |
| Viscosity at 25°C (cPs) | 1,600 |
| Cure schedule | 48 hrs @ 23°C |
| Hardness (Shore) | A 20 |
| Shelf life at 8-25°C (months) | 6 |
| Viscosity at 25°C (cPs) – COG/COF application | 700; 1,500 |
| Cure schedule – COG/COF application | Tack-free time: 10min; Full cure time: 7 days |
| Hardness (Shore) – COG/COF application | A 23 |
Applications
- Potting and encapsulation for circuit board protection
- Shallow potting
- Chip-on-glass / chip-on-film (COG/COF) protection in displays
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
Only logged in customers who have purchased this product may leave a review.
Reviews
There are no reviews yet.