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H.B. Fuller FH8301 Flip Chip Underfill, High Tg Low CTE
H.B. Fuller FH8301 is a heat-cure underfill for flip chip and WLCSP packages, designed for high-reliability flip chip applications.
- High Tg and low CTE
- High reliability
- Cure schedule: 120 min @ 165°C
H.B. Fuller FH8301 is a heat-cure underfill for flip chip and WLCSP packages, designed for high-reliability flip chip applications. It combines a high Tg with a low CTE (CTE α1 35 ppm). FEYANA supplies H.B. Fuller FH8301 together with technical documentation and application selection support.
Key features
- High Tg and low CTE
- High reliability
- Cure schedule: 120 min @ 165°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 19,900 |
| Cure schedule | 120 min @ 165°C |
| Glass transition Tg (°C) | 122 |
| CTE α1 (ppm) | 35 |
| Pot life at 25°C (hours) | 8 |
| Shelf life (months) | 6 @ -40°C |
Applications
- Underfill for flip chip and wafer-level chip scale packages (WLCSP)
- High-reliability flip chip applications
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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