Name: H.B. Fuller FH8029 Board Level Underfill | FEYANA
SKU: HBF-FH8029

H.B. Fuller FH8029 High-Reliability Fast-Flow CSP Underfill

H.B. Fuller FH8029 is a high-reliability, fast-flow board-level underfill for CSP/BGA.

High-reliability, fast-flow CSP underfill
Cure schedule: 8 min @ 150°C
Tg 135°C

H.B. Fuller FH8029 is a high-reliability, fast-flow board-level underfill for CSP/BGA. It heat-cures in 8 min @ 150°C and has a Tg of 135°C with a CTE α1 of 55 ppm. FEYANA supplies H.B. Fuller FH8029 together with technical documentation and application selection support.

Key features

High-reliability, fast-flow CSP underfill
Cure schedule: 8 min @ 150°C
Tg 135°C

Technical data

Color	Black
Viscosity at 25°C (cPs)	600
Cure schedule	8 min @ 150°C
Glass transition Tg (°C)	135
CTE α1 (ppm)	55
Pot life at 25°C (hours)	72
Shelf life (months)	6 @ -20°C