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H.B. Fuller FH8633 Low-Temperature Cure Adhesive for Image Sensors
One-part low-temperature cure adhesive (5 min @ 80°C) for heat-sensitive parts; high bond strength to LCP.
- One-part, premixed, low-temperature cure
- Designed for image sensor assembly
- High bond strength to LCP
H.B. Fuller FH8633 is a one-part, premixed, low-temperature cure adhesive for heat-sensitive parts such as camera modules, sensors, touch panels and wearables. It is designed for image sensor assembly with high bond strength to LCP, and is used for lens holder to substrate (house) bonding. It is black, has a viscosity of 16,500 cPs at 25°C and cures at 5 min @ 80°C. FEYANA supplies FH8633 to electronics assembly plants.
Key features
- One-part, premixed, low-temperature cure
- Designed for image sensor assembly
- High bond strength to LCP
- Cure schedule: 5 min @ 80°C
- Pot life 3 days at 25°C; shelf life 6 months at -20°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 16,500 |
| Cure schedule | 5 min @ 80°C |
| Pot life at 25°C (days) | 3 |
| Shelf life at -20°C (months) | 6 |
Applications
- Lens holder to substrate (house) bonding in camera modules / image sensors
- Camera modules, sensors, touch panels, wearables and other heat-sensitive parts
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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