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H.B. Fuller FH8623M Low-Temperature Cure Adhesive
One-part low-temperature cure adhesive (5 min @ 80°C; 15 min @ 75°C) for heat-sensitive parts; good heat resistance, high adhesion.
- One-part, premixed, low-temperature cure
- Good thermal resistance
- High adhesion to a variety of substrates
H.B. Fuller FH8623M is a one-part, premixed, low-temperature cure adhesive for heat-sensitive parts such as camera modules, sensors, touch panels and wearables. It cures at low temperature, offers good thermal resistance and high adhesion to a variety of substrates. It is white, has a viscosity of 12,500 cPs at 25°C and cures at 5 min @ 80°C; 15 min @ 75°C. FEYANA supplies FH8623M to electronics assembly plants.
Key features
- One-part, premixed, low-temperature cure
- Good thermal resistance
- High adhesion to a variety of substrates
- Cure schedule: 5 min @ 80°C; 15 min @ 75°C
- Pot life 3 days at 25°C; shelf life 6 months at -20°C
Technical data
| Color | White |
|---|---|
| Viscosity at 25°C (cPs) | 12,500 |
| Cure schedule | 5 min @ 80°C; 15 min @ 75°C |
| Pot life at 25°C (days) | 3 |
| Shelf life at -20°C (months) | 6 |
Applications
- Camera modules, sensors, touch panels, wearables and other heat-sensitive parts
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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