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H.B. Fuller FH8028 Reworkable Epoxy Underfill, Pad-Safe
H.B. Fuller FH8028 is an epoxy board-level underfill for CSP/BGA that can be reworked without damaging the attach pads.
- Reworkable without damaging the attach pads
- Cure schedule: 8 min @ 150°C
- Tg 125°C
H.B. Fuller FH8028 is an epoxy board-level underfill for CSP/BGA that can be reworked without damaging the attach pads. With a Tg of 125°C, it is designed for high-reliability portable devices and is used in automotive electronics PCB assembly. FEYANA supplies H.B. Fuller FH8028 together with technical documentation and application selection support.
Key features
- Reworkable without damaging the attach pads
- Cure schedule: 8 min @ 150°C
- Tg 125°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 400 |
| Cure schedule | 8 min @ 150°C |
| Glass transition Tg (°C) | 125 |
| CTE α1 (ppm) | 55 |
| Pot life at 25°C (hours) | 72 |
| Shelf life (months) | 6 @ -20°C |
| Chemistry | Epoxy |
Applications
- Board-level underfill for CSP/BGA reinforcement
- High-reliability portable devices
- Automotive electronics PCB assembly
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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