Tiếng Việt
中文 (中国)
H.B. Fuller EH9665 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; it offers high green strength, good adhesion to most substrates and good thermal resistance.
- High green strength
- Good adhesion to most substrates
- Good thermal resistance
H.B. Fuller EH9665 is a light yellow reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. It offers high green strength, good adhesion to most substrates and good thermal resistance. It has a viscosity of 6,000 cPs @ 100°C at application temperature, an open time of 4 min, cures in 24 hours and reaches 7.2 MPa overlap shear strength on PC-PC. FEYANA supplies EH9665 to electronics assembly plants.
Key features
- High green strength
- Good adhesion to most substrates
- Good thermal resistance
- Viscosity at application temperature: 6,000 cPs @ 100°C
- Open time: 4 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 7.2 MPa
Technical data
| Color | Light Yellow |
|---|---|
| Viscosity at application temperature | 6,000 cPs @ 100°C |
| Open time (min) | 4 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 7.2 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
Only logged in customers who have purchased this product may leave a review.
Reviews
There are no reviews yet.