SEHO Systems GmbH (Kreuzwertheim, Germany) specialises in soldering technology for electronics manufacturing: wave soldering, selective soldering, reflow soldering and THT AOI. SEHO equipment serves PCB assembly plants, EMS providers and SMT lines that also handle through-hole components.
SEHO MWS 2300 is a high-end wave soldering system with a closed nitrogen tunnel for demanding boards at high throughput. The MWS 2335, 2340 and 2350 sizes give 350, 400 and 500 mm soldering width; the frame length is chosen to suit the heat demand.
Key features
- Closed nitrogen tunnel reaching low residual oxygen quickly with low nitrogen consumption
- Sector soldering: wave height and speed programmable for up to 16 board sectors
- Pulsar preheaters fire only where the board is, cutting energy use by up to 50% at low load
- Integrated ATS HVLP fluxer or external fluxer module; optional SEHO SelectFlux
- Electrically driven-out solder pot, optional automatic nozzle height, dual pot and automatic wave height correction
- Options for integrated cooling, process gas cleaning, oxygen sensor, SMEMA, Hermes, CFX and MES links
Technical data
| Item | MWS 2335 | MWS 2340 | MWS 2350 |
|---|---|---|---|
| Soldering width – finger conveyor | 350 mm | 400 mm | 500 mm |
| Soldering width – solder frame conveyor | 340 mm | 390 mm | 490 mm |
| Assembly weight (incl. frame) | 6 kg (finger) / 12 kg (frame) | ||
| Tunnel pass-through height | 90 or 110 mm | ||
| Conveyor segments / speed | max. 6 / 0.5–2.5 m/min | ||
| Preheat area (active length) | 1800–3300 mm | ||
| Preheat modules | convection 900 mm 9.6 kW; IR 3 kW; quartz 3.75 kW; Pulsar 4.5 kW | ||
| Solder wave width | – | 450 mm | 550 mm |
| Max. wave height | 10 mm | ||
| Standard solder pot | approx. 750 kg SnPb / 620 kg lead-free, 9 kW | ||
| Exhaust (soldering system) | Ø200 mm, 1250 m³/h | ||
| Total power consumption | from 28 kW depending on configuration | ||
| Nitrogen consumption | approx. 18–24 m³/h | ||
| Dimensions | width max. 1660 mm, height max. 1380 mm, length per configuration | ||
Applications in electronics manufacturing
- Soldering through-hole (THT) parts after the SMT stage on mixed SMD + THT boards
- Industrial electronics, power supplies, drives, control boards, LED drivers
- Automotive electronics, medical devices, telecom and home appliances
- SMT/EMS contract manufacturers needing higher throughput and consistent joints
FEYANA support in Vietnam
FEYANA supplies SEHO soldering equipment for projects in Vietnam: configuration advice based on board size and volume, passing technical enquiries to the manufacturer, quotations, delivery follow-up, coordination of installation and operator training, plus consumables and spare parts.
Information to send for a proposal
- Board size (length × width) and top/bottom component heights
- Volume (boards per shift) and target line speed
- Solder alloy (SnPb or lead-free SAC305) and flux type
- Nitrogen availability, site power supply and floor space
- Board handling: stand-alone, solder frames or in-line via SMEMA
Data from SEHO Systems GmbH technical documents, for reference only; the exact configuration depends on the order. SEHO is a trademark of SEHO Systems GmbH.
See more in PCB Wave & Selective Soldering (SMT/THT). Contact FEYANA for advice and a quotation: WhatsApp +84 988 641 591 – sales.00@feyana.com.


Reviews
There are no reviews yet.