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H.B. Fuller FH8009 Reworkable Board-Level CSP/BGA Underfill
H.B. Fuller FH8009 is a brown, heat-cure board-level underfill for CSP/BGA reinforcement.
- Fast capillary flow
- Reworkable
- Cure schedule: 8 min @ 130°C
H.B. Fuller FH8009 is a brown, heat-cure board-level underfill for CSP/BGA reinforcement. It flows fast, is reworkable and is designed for high-reliability portable devices. FEYANA supplies H.B. Fuller FH8009 together with technical documentation and application selection support.
Key features
- Fast capillary flow
- Reworkable
- Cure schedule: 8 min @ 130°C
Technical data
| Color | Brown |
|---|---|
| Viscosity at 25°C (cPs) | 627 |
| Cure schedule | 8 min @ 130°C |
| Glass transition Tg (°C) | 96 |
| CTE α1 (ppm) | 58 |
| Pot life at 25°C (hours) | 72 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Board-level underfill for CSP/BGA reinforcement
- High-reliability portable devices
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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