Tiếng Việt
中文 (中国)New
H.B. Fuller EP425 Epoxy Potting Compound, Shallow Potting
H.B. Fuller EP425 is a black epoxy potting compound that cures at medium-to-high temperature, intended for shallow potting and circuit board protection.
- Cures at medium-to-high temperature
- Excellent sealing performance
- Cure schedule: 30 min @ 80°C
H.B. Fuller EP425 is a black epoxy potting compound that cures at medium-to-high temperature, intended for shallow potting and circuit board protection. It seals very effectively and reaches Shore D 85. FEYANA supplies H.B. Fuller EP425 together with technical documentation and application selection support.
Key features
- Cures at medium-to-high temperature
- Excellent sealing performance
- Cure schedule: 30 min @ 80°C
Technical data
| Chemistry | Epoxy |
|---|---|
| Color | Black |
| Viscosity at 25°C (cPs) | 7,500 |
| Cure schedule | 30 min @ 80°C |
| Hardness (Shore) | D 85 |
| Shelf life (months) | 6 @ 2-8°C |
Applications
- Potting and encapsulation for circuit board protection
- Shallow potting
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
Only logged in customers who have purchased this product may leave a review.
Reviews
There are no reviews yet.