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H.B. Fuller FH8710 Tough Edge Bond Adhesive, High Tg
H.B. Fuller FH8710 is a heat-cure edge bond adhesive for CSP/BGA structural reinforcement with excellent toughness and bond strength.
- Excellent toughness and bond strength
- High Tg and low CTE
- Cure schedule: 8 min @ 130°C
H.B. Fuller FH8710 is a heat-cure edge bond adhesive for CSP/BGA structural reinforcement with excellent toughness and bond strength. A high Tg (117°C) and low CTE support durable reinforcement. FEYANA supplies H.B. Fuller FH8710 together with technical documentation and application selection support.
Key features
- Excellent toughness and bond strength
- High Tg and low CTE
- Cure schedule: 8 min @ 130°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 16,300 |
| Cure schedule | 8 min @ 130°C |
| Glass transition Tg (°C) | 117 |
| CTE α1 (ppm) | 39 |
| Pot life at 25°C (hours) | 24 |
| Shelf life (months) | 6 @ -20°C |
Applications
- Edge bonding for structural reinforcement of CSP/BGA components
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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