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H.B. Fuller FH8636 Low-Temperature Cure Adhesive for Camera Modules
One-part low-temperature cure adhesive (10 min @ 80°C) for heat-sensitive parts; low bleeding, house and bearing bonding.
- One-part, premixed, low-temperature cure
- Very fast curing at low temperature
- High bond strength on a variety of substrates
H.B. Fuller FH8636 is a one-part, premixed, low-temperature cure adhesive for heat-sensitive parts such as camera modules, sensors, touch panels and wearables. It cures very fast at low temperature, gives high bond strength on a variety of substrates, low bleeding and excellent thermal performance, and is used for house bonding and motion system bearing bonding in camera modules. It is black, has a viscosity of 24,890 cPs at 25°C and cures at 10 min @ 80°C. FEYANA supplies FH8636 to electronics assembly plants.
Key features
- One-part, premixed, low-temperature cure
- Very fast curing at low temperature
- High bond strength on a variety of substrates
- Low bleeding
- Excellent thermal performance
- Cure schedule: 10 min @ 80°C
- Pot life 3 days at 25°C; shelf life 6 months at -20°C
Technical data
| Color | Black |
|---|---|
| Viscosity at 25°C (cPs) | 24,890 |
| Cure schedule | 10 min @ 80°C |
| Pot life at 25°C (days) | 3 |
| Shelf life at -20°C (months) | 6 |
Applications
- House bonding and motion system bearing bonding in camera modules
- Camera modules, sensors, touch panels, wearables and other heat-sensitive parts
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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