FEYANA one-component thermally conductive silicone bonds, seals and transfers heat while keeping silicone flexibility to absorb thermal expansion stress. FX196 cures with moisture at room temperature; FX172 is heat cured to high hardness.
Specifications
| Brand | FEYANA |
|---|---|
| Chemistry | One-component thermally conductive silicone |
| Thermal conductivity | 1.8 – 3 W/mK |
| Operating temperature | -55 ~ 200°C |
Product range
| Product | Color | Viscosity (cps) / thixotropic index | Surface dry 25°C (min) | Curing | Hardness Shore | Thermal conductivity (W/mK) | Operating temp. (°C) |
|---|---|---|---|---|---|---|---|
| FX196W1 | White | 100,000~200,000/>3 | 3 | 25°C×3 days | A50 | 2 | -40~200 |
| FX172W2 | White | 30,000~60,000 | – | 100°C×90 min | A95 | 3 | -40~200 |
| FX172G | Gray | 60,000~80,000 | – | 150°C×30 min | A95 | 2 | -55~200 |
| FX172G1 | Gray | 30,000~60,000/3 | – | 130°C×60 min | A95 | 3 | -55~200 |
| FX196G3 | Gray | 300,000~600,000/>4 | 5 | 25°C×7 days | A72 | 3 | -50~200 |
| FX196BL | Black | 80,000~100,000/>2 | 5 | 25°C×7 days | A50 | 1.8 | -40~200 |
Typical values from FEYANA technical data for selection reference only; please test on your actual substrates before mass production. Viscosity, colour, cure speed and packaging can be customised on request.
Key features
- Bonding and heat transfer in one step
- Flexible, excellent thermal cycling
- Moisture-cure and heat-cure grades
Applications
- Heat sink bonding, fixing power components
- LED modules, power supplies, chargers
- Automotive electronics
Technical support and quotation
Send FEYANA your substrates, operating conditions (temperature, environment), thermal conductivity, flame-retardancy and hardness requirements, application method (manual, cartridge gun, dispensing machine) and volume for product recommendation, samples and a quotation. We supply from Vietnam across Southeast Asia.
- WhatsApp / Phone: +84 988 641 591
- Email: sales.00@feyana.com






Reviews
There are no reviews yet.