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H.B. Fuller FH8801C Conductive Adhesive for Camera Module Grounding
H.B. Fuller FH8801C is a silver, heat-cure electrically conductive adhesive for conductive grounding in camera modules.
- High electrical conductivity
- High bond strength
- Low stress
H.B. Fuller FH8801C is a silver, heat-cure electrically conductive adhesive for conductive grounding in camera modules. It combines high conductivity and bond strength with low stress, high Tg, low CTE, fast low-temperature cure and low outgassing. FEYANA supplies H.B. Fuller FH8801C together with technical documentation and application selection support.
Key features
- High electrical conductivity
- High bond strength
- Low stress
- High Tg and low CTE
- Fast, low-temperature cure
- Low outgassing
Technical data
| Color | Silver |
|---|---|
| Viscosity at 25°C (cPs) | 9,000 |
| Cure schedule | 90 s @ 110°C; 15 min @ 80°C |
| Pot life at 25°C (days) | 1 |
| Shelf life (months) | 6 @ -40°C |
Applications
- Conductive grounding in camera modules
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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