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H.B. Fuller AC768 2K Acrylic Structural Adhesive, Low Modulus
H.B. Fuller AC768 is a 10:1 two-component acrylic structural adhesive with low modulus and high elongation.
- High strength and impact resistance
- Low modulus
- High elongation
H.B. Fuller AC768 is a 10:1 two-component acrylic structural adhesive with low modulus and high elongation. It still provides high strength and impact resistance and bonds most substrates in electronics assembly. FEYANA supplies H.B. Fuller AC768 together with technical documentation and application selection support.
Key features
- High strength and impact resistance
- Low modulus
- High elongation
- Bonds most common substrates
Technical data
| Color | A: Off-white / B: Blue |
|---|---|
| Viscosity at 25°C (cPs) | A: 20,000 / B: 31,000 |
| Mix ratio A:B | 10:1 |
| Fixture time (min) | 7 |
| Working time at 25°C (min) | 5 |
| Shelf life at 8-25°C (months) | 9 |
Applications
- Structural bonding in electronics assembly
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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