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H.B. Fuller EH9663 Reactive Hot Melt for Mobile Device Assembly
Reactive hot melt for touch panel and mobile phone parts assembly; high green strength and primerless adhesion.
- High green strength for immediate handling, processing and testing
- Good adhesion to a wide range of substrates without primers
- Viscosity at application temperature: 3,800 cPs @ 100°C
H.B. Fuller EH9663 is a light yellow reactive hot melt adhesive for mobile device assembly, such as touch panel assembly and mobile phone parts bonding. Its high green strength allows immediate handling, processing and testing, and it bonds well to many substrates without primers. It has a viscosity of 3,800 cPs @ 100°C at application temperature, an open time of 4 min, cures in 24 hours and reaches 6.9 MPa overlap shear strength on PC-PC. FEYANA supplies EH9663 to electronics assembly plants.
Key features
- High green strength for immediate handling, processing and testing
- Good adhesion to a wide range of substrates without primers
- Viscosity at application temperature: 3,800 cPs @ 100°C
- Open time: 4 min
- Full cure in 24 hours
- Overlap shear strength (OLSS) PC-PC: 6.9 MPa
Technical data
| Color | Light Yellow |
|---|---|
| Viscosity at application temperature | 3,800 cPs @ 100°C |
| Open time (min) | 4 |
| Cure time (h) | 24 |
| OLSS, PC-PC (MPa) | 6.9 |
Applications
- Touch panel assembly
- Mobile phone parts bonding
Data are typical values from the manufacturer’s literature. Contact us for the TDS/SDS and selection advice.
Contact FEYANA: WhatsApp/Zalo +84 988 641 591 – sales.00@feyana.com
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