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FEYANA JA447 Silicone Thermal Grease, 1.5–5.5 W/mK
FEYANA JA447 silicone-based thermal grease: 1.5–5.5 W/mK, low thermal impedance, continuous use up to 180–200°C, for CPUs, IGBTs, LEDs and power supplies.
FEYANA JA447 silicone thermal grease (thermal paste) fills microscopic gaps between heat sources and heat sinks, lowering thermal impedance for fast heat transfer. The silicone base offers high heat resistance, low volatility, long-term stability and compatibility with rubber and plastics.
Specifications
| Brand | FEYANA |
|---|---|
| Base | Silicone |
| Thermal conductivity | 1.5 – 5.5 W/mK |
| Max. continuous operating temperature | 180 – 200°C |
Product range
| Product | Color | Viscosity (cps) / thixotropic index | Specific gravity | Max. continuous operating temp. (°C) | Thermal impedance (m²K/W) | Thermal conductivity (W/mK) |
|---|---|---|---|---|---|---|
| JA447 | White | 2,000,000~8,000,000/5 | 2.1 | 200 | 5.54×10⁻³ | 1.5 |
| JA447-6 | White | 1,500,000~3,500,000 | 2.4 | 200 | 6.63×10⁻³ | 2.5 |
| JA447-20 | White | >6,000,000 | 2.8 | 180 | 4.66×10⁻³ | 2.5 |
| JA447-30 | White | 1,100,000~3,400,000 | 3 | 200 | 5.07×10⁻³ | 3.2 |
| JA447-26 | White | 500,000~750,000 | 3 | 180 | 4.54×10⁻³ | 3.4 |
| JA447-45 | White | 1,280,000~2,400,000 | 3.2 | 180 | 1.35×10⁻³ | 4.1 |
| JA447-41 | White | 1,400,000~2,000,000 | 3.3 | 180 | 3.68×10⁻³ | 5.5 |
| JA447-35 | Gray | 210,000~450,000 | 2.5 | 200 | 6.52×10⁻³ | 2.5 |
Silicone vs non-silicone thermal grease
| Characteristic | Silicone-based | Non-silicone |
|---|---|---|
| Thermal conductivity | Medium–high (1~12 W/mK) | Medium–high (1~12 W/mK) |
| Temperature range | -50 ~ 200°C | -40 ~ 150°C |
| Lifespan / stability | High temperature resistant, low volatility, good stability | May volatilise at high temperatures |
| Material compatibility | Rubber, plastics | Better compatibility with plastics, metals, electronics |
| Cost | Medium, general applications | Higher, specialised formulations |
Typical values from FEYANA technical data for selection reference only; please test on your actual substrates before mass production. Viscosity, colour, cure speed and packaging can be customised on request.
Key features
- High conductivity, low thermal impedance
- Non-curing, easy rework
- Up to 200°C, low volatility
Applications
- CPUs, GPUs, servers, computers
- IGBTs, inverters, power supplies
- LED lighting, EV charging modules
- EV batteries, 5G equipment
Technical support and quotation
Send FEYANA your substrates, operating conditions (temperature, environment), thermal conductivity, flame-retardancy and hardness requirements, application method (manual, cartridge gun, dispensing machine) and volume for product recommendation, samples and a quotation. We supply from Vietnam across Southeast Asia.
- WhatsApp / Phone: +84 988 641 591
- Email: sales.00@feyana.com
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